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Home › Indium Corporation Technology Expert to Present at IMAPS Conference on Device Packaging

 

Indium Corporation Technology Expert to Present at IMAPS Conference on Device Packaging

2015-02-13 11:30:23| Industrial Newsroom - All News for Today

Indium Corporations Maria Durham, technical support engineer for semiconductor and advanced assembly materials, will present at IMAPSs International Conference and Exhibition on Device Packaging March 17-19 in Scottsdale, Ariz. The semiconductor assembly industry continues its movement toward finer pitch...

Tags: technology present corporation conference

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