<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will present at the <a href="http://www.impact.org.tw/2013/General/">International Microsystems Packaging Assembly and Circuits Technology conference</a> (IMPACT) on Thursday, October 24 in Taipei, Taiwan. <br />
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Dr. Lee’s presentation, A Novel Epoxy Flux on Solder Paste for High-Reliability POP Assembly, ...