Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at IPC’s Innovations in Electronics Manufacturing for Medical Devices conference Wednesday, June 12 in Minneapolis, MN.<br />
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Dr. Lee’s presentation, Voiding Control and Reliability of Solder Joints with Backward Compatibility, will discuss the voiding performance of backward compatible systems in terms of reflow profiles, and alloy combinations. Additionally, he will compare tin-lead ...