Indium Corporation’s Graham Wilson, applications engineer, will present at IMAPS UK Heat of the Matter (HtM) Technical Conference, Oct. 23 at the University of Oxford, U.K.<br />
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Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will ...