Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM™, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling. Solder joint architectures that utilize both SACM™ solder paste and SACM™ solder balls realize the maximum ...