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Indium Corporation and Duksan Hi-Metal Form Strategic Alliance for SACM(TM) Solder Balls

2013-07-18 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM™, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling. Solder joint architectures that utilize both SACM™ solder paste and SACM™ solder balls realize the maximum ...

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