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Home › Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability

 

Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability

2013-11-07 06:00:00| Industrial Newsroom - All News for Today

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 - 14 in Costa Mesa, California.<br /> <br /> Dr. Ning-Cheng Lee, Vice President of Technology, will present Challenges for Migration toward Low Temperature Lead-Free Soldering. This presentation reviews the joint mechanical strength, drop test performance, and voiding performance of BGAs assembled with SAC105, SAC305, and BiSnAg.<br /> <br /> Dr. Ron Lasky, Senior ...

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