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Indium Corporation's VP of Technology to Present at ICEPT 2014

2014-08-06 06:00:00| Industrial Newsroom - All News for Today

Indium Corporation&rsquo;s Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.<br /> <br /> Dr. Lee&rsquo;s presentation, Reliability of BGA Assembly Alloys Containing BiSn Low-Melting Solders, explores the feasibility of replacing SAC solders with a low-temperature solder to potentially reduce materials cost. His evaluation is based on joint mechanical strength, drop test ...

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