With 1 top-down viewing camera, 4 side-viewing cameras, and 3D inspection, Model FX-940 is suitable for inspection of solder defects, lead defects/lifted leads, component presence/position, correct part/polarity, through-hole parts, and co-planarity of chips and BGAs. System is configurable for all line positions and equally effective for paste, pre/post-reflow, and final assembly inspection. Other features include real-time SPC monitoring and Advanced Fusion Lighting.
This story is related to the following:Assembly Verification Inspection Systems | Printed Circuit Board (PCB) Inspection Systems