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Innovative 3D Integration Technology Could Improve Industrial Processes

2013-08-08 08:48:14| wirelessdesignonline News Articles

The latest gadgets hitting the market are smaller and faster than ever before, and rapidly-emerging 3D integration technology plays a major role in this evolution. The process, which consists in stacking 2D dies and connecting them in the 3rd dimension in order to speed up communication between chips, can be found in appliances such as miniaturised implantable medical devices and radio frequency devices found in mobile phones.

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