Home Innovative Air Cavity Packaging Brings Significant Cost Reductions And Performance Improvements To RF Transistors Used In Wireless Infrastructure
 

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Innovative Air Cavity Packaging Brings Significant Cost Reductions And Performance Improvements To RF Transistors Used In Wireless Infrastructure

2016-05-17 07:09:04| rfglobalnet News Articles

Ampleon recently announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio.

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Category:Telecommunications

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