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Home › Innovative Air Cavity Packaging Brings Significant Cost Reductions And Performance Improvements To RF Transistors Used In Wireless Infrastructure

 

Innovative Air Cavity Packaging Brings Significant Cost Reductions And Performance Improvements To RF Transistors Used In Wireless Infrastructure

2016-05-17 07:09:04| wirelessdesignonline News Articles

Ampleon recently announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio.

Tags: used air cost performance

Category:Telecommunications

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