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Inspection System offers application-specific configurations.

2013-07-30 14:30:06| Industrial Newsroom - All News for Today

With Metrology suite, NSX® 320 Automated Macro Defect Inspection System offers wafer level packaging configuration, which measures film thickness, thin remaining silicon thickness, surface topography, copper pillar height, and solder bump height. Advanced wafer level packaging configuration (2.5D) adds measurement of wafer profile, total stack thickness, and thick/thin RST, while 3DIC configuration is capable of all measurements plus via depth, trench depth, bonded wafer TTV, and adhesive layers. This story is related to the following:3D Inspection Systems | Inspection Equipment | Wafer Inspection Devices

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