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Inspection System supports advanced semiconductor packaging.
2015-04-27 14:31:07| Industrial Newsroom - All News for Today
Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems help address such challenges as fine feature sizes and tight pitch requirements.
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Category:Industrial Goods and Services