Home Kingyoup Unveils High Throughput Semiconductor Wafer Bonding & Debonding Tool at ECTC ...
 

Keywords :   


Kingyoup Unveils High Throughput Semiconductor Wafer Bonding & Debonding Tool at ECTC ...

2014-06-13 06:00:00| Industrial Newsroom - All News for Today

NEW TAIPEI CITY – KingyoupOptronics Co., Ltd. ("Kingyoup") during the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased their temporary bonding and debonding equipment developed in collaboration with IBM (NYSE:IBM). This equipment is specially designed to meet the microelectronics miniaturization needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D Integrated Circuits, 2.5D Packaging ...This story is related to the following:Wafer Processing Systems |

Tags: high tool amp semiconductor

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
28.11SHODO-X 12 7
28.11 CT 300MG RIGHT() 24
28.11Coleman
28.11CD / 88cm CDS
28.11PSA10 e
28.11YAMAHA
28.11PSA 10 HOLW91055
28.11nima
More »