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Kulicke & Soffa Joins High-Density Fan-Out Wafer Level Packaging Consortium

2015-04-18 13:21:54| Semiconductors - Topix.net

Through the collaboration, K&S is confident that with the combined experience and knowledge, the consortium will extend FOWLP capabilities for applications, such as tablets and smart phones, and provide solutions to overcome current FOWLP limitations. FOWLP enables multiple chips to be integrated in small form factor on a single package.

Tags: level packaging joins consortium

Category:Electronics and Electrical

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