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Laser Material Processing System utilizes hybrid technology.
2014-08-28 14:33:46| Industrial Newsroom - All News for Today
Suitable for cutting, marking, and engraving of both organic and inorganic materials, XLS10MWH Multiwave Hybrid™ System combines laser energy from CO2 lasers of 9.3 or 10.6 microns and fiber laser of 1.06 microns into simultaneous delivery of single beam. Control of lasers individually or simultaneously provides infinite laser energy combinations for development of laser material processes. System supports processing of aerospace, automotive, electronic, and other engineered materials. This story is related to the following:Machinery and Machining Tools Sponsored by: AMT (IMTS) - Category Sponsor April2014Carbon Dioxide Lasers | Cutting Lasers | Marking Lasers |
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Category:Industrial Goods and Services