Offering adjustable beam spot diameters from 0.1–3.0 mm, Multi-Phi Laser Soldering System optimizes soldering conditions for each component. Diameter range is determined by optical fibers and lens configuration. Laser’s output power is converted into thermal energy, and robot’s z-axis (vertical) stays fixed when adjusting beam diameter. Supporting variety of soldering patterns, component shapes, and sizes, Multi-Phi can feed solder wire from any direction with feeding mechanism.