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Leadless Ceramic SMT Package meets optoelectronic circuit needs.
2015-01-05 14:31:50| Industrial Newsroom - All News for Today
JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution as alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on surface-mountable substrate eliminates need for through-hole mounting of device on PCB.
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Category:Industrial Goods and Services