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Liquid Cooling Moves Onto The Chip For Denser Electronics
2015-10-06 07:11:51| wirelessdesignonline News Articles
Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating.
Tags: electronics
liquid
moves
chip
Category:Telecommunications
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