Home › Liquid Cooling Moves Onto The Chip For Denser Electronics
 

Keywords :   


Liquid Cooling Moves Onto The Chip For Denser Electronics

2015-10-06 07:11:51| wirelessdesignonline News Articles

Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating.

Tags: electronics liquid moves chip

Category:Telecommunications

Latest from this category

All news
»
21.09Atlantic Tropical Weather Outlook
21.09Eastern North Pacific Tropical Weather Outlook
20.09Labelexpo Americas highlights, Maxcess announces acquisition and more
20.09September Cattle on Feed as expected
20.09USDA announces major investment in meat and poultry processing
20.09Atlantic Tropical Weather Outlook
20.09Eastern North Pacific Tropical Weather Outlook
20.09This weeks lesson: Weaning matters in the cattle market
More »