Home Macro Defect Inspection Tool targets advanced packaging/metrology.
 

Keywords :   


Macro Defect Inspection Tool targets advanced packaging/metrology.

2015-09-10 14:31:05| Industrial Newsroom - All News for Today

Able to produce complete wafer characterization within packaging process, NSX® 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability. Compatibility and functionality help accelerate ramp and improve yield.

Tags: advanced tool inspection targets

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
28.11 HEXAGON TR SET UP
28.1121dc hg
28.111EX D
28.11 Bucchus IMP24 FMH-RSM/M
28.11
28.11specialites TA carmina 46-36
28.11HUNTER×HUNTER
28.11
More »