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Macro Defect Inspection Tool targets advanced packaging/metrology.

2015-09-10 14:31:05| Industrial Newsroom - All News for Today

Able to produce complete wafer characterization within packaging process, NSX® 330 Series provides high-speed macro defect inspection and 2D and 3D metrology. Optional metrology capabilities for both 2D and 3D applications include 100% bump height and coplanarity, and 3D capability enables simultaneously measurement of topography and thickness with nanometer-level repeatability. Compatibility and functionality help accelerate ramp and improve yield.

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Category:Industrial Goods and Services

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