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Manufacturing Software optimizes jetting underfill for flip chips.

2013-07-29 14:29:42| Industrial Newsroom - All News for Today

Used for jetting underfill for flip chips, Continuous Path Motion Control software optimizes dispense head motion to conserve time and increase units per hour (UPH). Dispense head maintains continuous speed and direction throughout process instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating. Depending on actual die layout, dispensing conditions, flow rate, and other factors, software conserves 23% dispensing cycle time at 9 mg/sec flow rate. This story is related to the following:Manufacturing Software

Tags: software manufacturing chips flip

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