Applying non-destructive analysis to microscopic areas of large samples, such as 300 mm wafers, 20/30 XL™ measures thin film thickness as well as Raman spectra of microscopic sampling areas. Flexible design does not impose upper limit to sample size, and thickness of thin films can also be measured in both transmission and reflectance. Along with manual or automated operation, capabilities also include UV and NIR microscopy of semiconductor and other types of samples.