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Miniaturized Bluetooth Smart System-In-Package Module Removes Need For RF Expertise When Developing Smallest Smartphone Appcessories And Sensors

2014-05-27 14:37:29| rfglobalnet Home Page

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA recently announces that French multi-die system-in-package (SiP) design specialist, Insight SiP, has developed a miniaturized Nordic nRF51822 System-on-Chip-based Bluetooth Smart module that requires no specialist RF engineering experience to employ and targets highly space-constrained smartphone and tablet appcessories, and computer accessories, such as body-worn health and wellness sensors and key fob proximity detectors.

Tags: developing smart module bluetooth

Category:Telecommunications

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