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Molex Unveils The RF DIN 1.0/2.3 Modular Backplane System

2013-06-06 09:26:22| rfglobalnet News Articles

Molex Incorporatedannounces recently a high-performance connector system designed specifically to enable PCB developers in the video, commercial broadcast and telecommunications industries to transfer multiple RF signals across mated boards in a single assembly while taking into consideration space constraints.

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Category:Telecommunications

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