Combining 3D IC sensor with Wafer Level Packaging, Model MXC400xXC enables mobile consumer devices such as phones, tablets, toys, and wearable devices. Thermal accelerometer technology uses thermal convection of heated gas molecules inside sealed cavity to sense acceleration or inclination. Measuring 1.2 x 1.7 mm, accelerometer provides 12-bit resolution on all 3 axes, programmable FSR of ±2 g/±4 g/±8 g, 8-bit temperature output, plus orientation/shake detection.
This story is related to the following:Miniature Accelerometers |