Sealed in 11.5 x 13 mm FBGA package, 16 GB Model THGBMBG7D2KBAIL and 32 GB Model THGBMBG8D4KBAIR integrate NAND chips fabricated with 19 nm process technology and dedicated controller. JEDEC e-MMC V5.0 compliant interface handles essential functions, including writing block management, error correction, and driver software. By applying HS400 high speed interface standard, Models THGBMBG7D2KBAIL and THGBMBG8D4KBAIR offer write speeds of 50 and 90 MBps, respectively, with read speed of 270 MBps.
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