Home Needle-Bonding Adhesives increased throughput via cure speed.
 

Keywords :   


Needle-Bonding Adhesives increased throughput via cure speed.

2013-06-05 14:28:09| Industrial Newsroom - All News for Today

With typical cure time of 2.5 sec or less, 1400 Series LED-curable needle bonders increase production speed and throughput while promoting quality control with aid of fluorescing technology. Adhesives cure with 385 or 405 nm wavelengths, allowing design flexibility within automation process, and are available in 15 L pails. Products pass ISO 10993-5 Cytotoxicity testing and support short-term (<29 days) implantation or single-use disposable device applications. This story is related to the following:Adhesives

Tags: speed increased cure throughput

Category:Industrial Goods and Services

Latest from this category

All news

19.11POWTEX2024 The 25th International Powder Technology Exhibition Tokyo
Industrial Goods and Services »
24.11Costume
24.11BB S604ULS
24.1133
24.11 ElectronicAudioExperimentsDude Incedible
24.11 TC101 5IP 6 NS.NEO 950GH S
24.11
24.11
24.11
More »