Home Needle-Bonding Adhesives increased throughput via cure speed.
 

Keywords :   


Needle-Bonding Adhesives increased throughput via cure speed.

2013-06-05 14:28:09| Industrial Newsroom - All News for Today

With typical cure time of 2.5 sec or less, 1400 Series LED-curable needle bonders increase production speed and throughput while promoting quality control with aid of fluorescing technology. Adhesives cure with 385 or 405 nm wavelengths, allowing design flexibility within automation process, and are available in 15 L pails. Products pass ISO 10993-5 Cytotoxicity testing and support short-term (<29 days) implantation or single-use disposable device applications. This story is related to the following:Adhesives

Tags: speed increased cure throughput

Category:Industrial Goods and Services

Latest from this category

All news

»
14.11AKB48 1st
14.11kindle 10
14.11
14.11YAMAHA PORTATONE PSR-340
14.112003 112
14.11 14533.5
14.11caligari 17
14.11 amnjx 27circus
More »