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Negative I-Line Photoresist has hydrophobic cured chemistry.
2013-06-25 14:28:21| Industrial Newsroom - All News for Today
With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance to moisture and corrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165°C and moderate modulus of 4.5 GPa at 25°C. NR series comes in solids/viscosities that achieve 2–40 µm thickness in single layer. This story is related to the following:Materials and Material ProcessingTest and Measuring InstrumentsPhotoresist Spinners | Microelectromechanical Systems (MEMS) Photomask Fabrication | Microelectromechanical Systems (MEMS) |
Tags: negative
chemistry
cured
hydrophobic
Category:Industrial Goods and Services