With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance to moisture and corrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165°C and moderate modulus of 4.5 GPa at 25°C. NR series comes in solids/viscosities that achieve 2–40 µm thickness in single layer.
This story is related to the following:Materials and Material ProcessingTest and Measuring InstrumentsPhotoresist Spinners | Microelectromechanical Systems (MEMS) Photomask Fabrication | Microelectromechanical Systems (MEMS) |