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Nihon Superior to Address Soldering Challenges at NEPCON South China

2013-07-01 06:00:00| Industrial Newsroom - All News for Today

OSAKA, JAPAN – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental ...This story is related to the following:Green & CleanSearch for suppliers of: Lead-Free Solder | Soldering Flux | Electrical Solder |

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