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Nordson ASYMTEK Demonstrates Dual-Action Underfill at NEPCON China Booth #1F61

2013-04-17 06:00:00| Industrial Newsroom - All News for Today

Throughput increased 60-85%<br /> <br /> Carlsbad, CA, USA &ndash; Nordson ASYMTEK (NASDAQ: NDSN), a leader in dispensing, coating, and jetting technologies, will demonstrate its Spectrum&trade; S-920 with dual-action dispensing at NEPCON China Booth #1F61. This high-volume system's multitasking capabilities can increase throughput by 60 to 85 percent for flip-chip underfill, chip encapsulation, and thermal compound applications.<br /> <br /> Dual-action dispensing enables dispensing of two ...This story is related to the following:Coating Process Equipment |

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