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ODVA Features Benefits of Ethernet/IP for Manufacturers at Pack Expo in September

2013-09-18 06:00:00| Industrial Newsroom - All News for Today

ODVA has accepted an invitation by PMMI to join the Association Pavilion at PACK EXPO Las Vegas on Sept 23–25. ODVA’s attendance at the show will provide a critical touchpoint for end users and OEMs who are seeking to learn the benefits about the use of EtherNet/IP and the Common Industrial Protocol in their packaging applications. ODVA will be located at Booth C-343 in the Association Pavilion in the Central Exhibit Hall.

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Category:Industrial Goods and Services

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