Home › PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New "Jet" Module Increases SPI Throughput and ROI
 

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PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New "Jet" Module Increases SPI Throughput and ROI

2015-03-03 11:31:14| Industrial Newsroom - All News for Today

MARLBORO, MA  PARMI, a leader in 3-D solder paste inspection (SPI) of printed circuit boards, announces that it has been awarded a 2015 NPI Award in the category of Test Inspection SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was...

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