Offering solution for IC, package, and PCB co-design, Xpedition® Package Integrator automates planning, assembly, and optimization of complex multi-die packages. System provides formal flow for BGA ball-map planning and optimization based on intelligent pin concept, defined by user rules. In addition, multi-mode connectivity management system — incorporating HDL, spreadsheet, and graphical schematic — provides cross-domain pin-mapping and system level cross-domain logical verification.