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PVD System aids 300 mm power device manufacturing.
2013-09-09 14:30:33| Industrial Newsroom - All News for Today
With options that include modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers, Sigma fxP addresses challenges faced while scaling power physical vapor deposition (PVD) processes up to 300 mm wafer size. System deposits thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. It also carries thin wafer handling hardware and uses film deposition stress control to maximize throughput with minimal wafer bow. This story is related to the following:Physical Vapor Deposition (PVD) Systems
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power
device
manufacturing
Category:Industrial Goods and Services