MRC® Eclipse™ Star, Mark II, and Mark IV physical vapor deposition (PVD) systems, which cover 100–200 mm wafer size capability for front or backside metallization, support integrated PVD process solutions for MEMS, sensors, and Internet of Things (IoT) applications. Processes include deposition of ceramic materials for gas and chemical sensors, aluminum oxide deposition for surface passivation of reflective materials, and deposition of complex metal film stacks for liftoff applications.