Addressing needs of Fan Out Wafer Level Processing (FOWLP) market, AKM600P enables concurrent and complete, single-shot warpage measurement of entire panel and individual die on panels up to 600 x 600 mm. Complete measurement and analysis of panel of this size provides z-resolution down to 1.25 µm and takes <2 sec to complete using Shadow Moiré technology. Also, warpage measurements can be conducted at room temperature or up to 300°C.