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Pb-Free Solder Paste delivers high first pass yields.

2013-12-16 14:30:45| Industrial Newsroom - All News for Today

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. This story is related to the following:Solder Paste

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