Available on EVG150XT Resist Coating System for high-volume manufacturing semiconductor applications, NanoSpray provides conformal coating of structures that have vertical sidewall angles, such as through-silicon vias, through-glass vias, and through-substrate vias used for 2.5D interposers and 3D-ICs. NanoSpray can deposit polymer liners ranging from 1–20 microns thick, minimizing mechanical stress and optimizing electrical performance of advanced-packaging interconnect structures.
This story is related to the following:Conformal Coating Machinery |