Intended for high-volume logic and memory manufacturing, 300 mm EVG®150XT features 9 process modules that can operate simultaneously for multi-parallel wafer processing. System incorporates smart scheduling software for throughput-optimized handling sequences, along with pumps and dispense systems tailored for thick film applications. With in-line metrology module, variety of process irregularities and defects can be detected to enable real-time process corrections.
This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category SponsorWafer Processing Systems | Lithography Machinery |