FlexVIA-Plus™ delivers single-stage plasma processing, including etchback, desmear, and descum capabilities, for up to 30, 20 x 32 in. panels per cycle. Achieving rate of as much as 200 units/hr for manufacture of flexible electronic PCBs and substrates, system features horizontal electrode design with integrated rack that optimizes material alignment for plasma treatment uniformity. Horizontal racks also allow for processing of various flexible PCB sizes and facilitate loading.
This story is related to the following:Plasma Surface Treatment Systems |