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Qualcomm, TDK form JV for RF components
2016-01-13 10:14:00| Telecompaper Headlines
(Telecompaper) Qualcomm and TDK have signed an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and business segments such as IoT, drones, robotics, automotive applications and more. The joint venture will operate under the name RF360 Holdings Singapore.
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Category:Telecommunications
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