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Rehm Thermal Systems Announces Three Next-generation Soldering Solutions
2013-01-01 06:00:00| Industrial Newsroom - All News for Today
Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process.<br /> <br /> Rehm offers three VS Series Vacuum Soldering system models. They’re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging. The use of different gases as well as formic acid and microwave ...This story is related to the following:Soldering Machinery
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Category:Industrial Goods and Services