Featuring robot with dual arms for accelerated wafer swapping, EVG®120 Automated Resist Processing System supports coating and developing applications for MEMS systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in diameter, EVG120 includes CoverSpin™ rotating bowl cover for coating uniformity across substrate.
This story is related to the following:Printing and Duplicating EquipmentWafer Processing Systems | Lithography Machinery |