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Rudolph Announces New SONUS Technology And Collaboration With TEL NEXX For Advanced Packaging Process Control

2014-08-07 10:37:33| metrologyworld Home Page

Rudolph Technologies, Inc. announced recently the availability of its new SONUS Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs)

Tags: advanced tel control technology

Category:Industrial Goods and Services

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