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Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications
2015-03-18 11:31:13| Industrial Newsroom - All News for Today
Tool to be used for development of copper pillar bumping and TSV processes Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep Advanced Packaging Lithography System for evaluation. The tool, which...
Tags: system
advanced
applications
packaging
Category:Industrial Goods and Services
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