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Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

2015-02-02 15:29:40| Semiconductors - Topix.net

This new customer will use the JetStep W Series for fan-out wafer level packaging applications. "The customer was seeking to add capacity for ramp in 2015 and chose our JetStep solution because it offered them a 20-30 percent productivity improvement over their existing lithography tool set, and better overlay performance, which is expected to result in higher yields.

Tags: system applications ships packaging

Category:Electronics and Electrical

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