Home Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications
 

Keywords :   


Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

2015-04-30 12:31:11| Industrial Newsroom - All News for Today

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...

Tags: level orders applications inspection

Category:Industrial Goods and Services

Latest from this category

All news

31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
07.11Hurricane Rafael Graphics
07.11Hurricane Rafael Wind Speed Probabilities Number 14
07.11Hurricane Rafael Forecast Discussion Number 14
07.11Hurricane Rafael Forecast Advisory Number 14
07.11Hurricane Rafael Public Advisory Number 14
07.11Tropical Depression Fourteen-E Graphics
07.11Tropical Depression Fourteen-E Forecast Discussion Number 3
07.11Tropical Depression Fourteen-E Wind Speed Probabilities Number 3
More »