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Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

2015-04-30 12:31:11| Industrial Newsroom - All News for Today

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep Advanced Packaging Lithography...

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