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SMT Hybrid Packaging to include hand soldering competition.
2016-03-10 14:31:09| Industrial Newsroom - All News for Today
During IPC’s Hand Soldering Competition at SMT Hybrid Packaging 2016, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria, speed at which assembly was produced, and overall electrical functionality of assembly. Participants will compete for cash prizes and a coveted spot at the IPC Hand Soldering World Championship at IPC APEX EXPO® in 2017.
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Category:Industrial Goods and Services