Available for 0.5 mm pitch, dual-row QFN devices, SF-QFN132A-A-01 SMT Package Emulator Foot enables connection to 0.5 mm pitch QFN/MLF pads. Gold-plated pads on bottom precisely match pin layout for MLF/QFN package, including E-pad or heatsink pad in center of pattern, allowing connection to QFN land pattern of target board in order to provide interconnects for probing or connecting to another assembly. Product has same footprint as MLF/QFN 132 pin IC and is 3.0 mm high.
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