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SPTS Technologies And CEA-Leti / Nanoelec RTI Collaborate On 3D-TSV Technology

2014-06-30 09:14:17| chemicalonline Home Page

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, recently announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies The two-year agreement enters under the framework of the Nanoelec Research

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